Giammarrusti - prodotti per elettronica - aziende rappresentate

The X-Series accelerates the route from CAD data to first products. It comprises highly cost-effective, all-in-one solutions for small and medium batch sizes with a high product mix. Well suited to production of large boards and handling of odd-size components, the modular machines are easily configured for an ultra-high feeder count.

Overview & Benefits

The X-Series (Opal-X^II, Opal FP-X^II, Topaz-X^II and Emerald-X^II) are complementary and cost-effective Pick & Place platforms for low to medium volume manufacturing at up to 20k components per hour. The machines are easily configured for a high feeder count, and for production of large boards. The machines can be combined to suit specific production requirements. The X-Series provides a perfect balance between outstanding versatility and value for money. The machines use the same feeder platform, operating software and Graphical User Interface as the M-Series. The benefits of the X-Series include:

- Fast and simple machine setup with real-time component inventory check
- Fast production-run changeovers with user-friendly 20-position feeder exchange trolleys
- Easy-to-use and quick to learn
- Easily networked with a centralized component database You can seamlessly integrate the machines into your factory automation infrastructure, and scale their performance to meet your precise manufacturing needs.

____________________________________________________

Opal-XII
Excel today… expand tomorrow

The Opal-X^II features a high precision single placement beam carrying four or eight independent Super Fine heads with exchangeable nozzles. It places up to 17.7k components per hour with 40-micron accuracy. It handles components from 01005 to large connectors, fine-pitch QFP, BGA, µBGA and CSP packages, and components up to 15mm tall. The Opal-X^II holds up to 100 tape feeders including stick and bulk parts.

The Opal-X^II has standard features that improve product quality and manufacturing efficiency including:

- Automatic board width and thickness adjustment for fast changeover
- Automatic temperature feedback compensates for temperature variations
- Fiducial recovery function that eliminates the need to remove and clean PCBs
- Multi-angle side illumination for any component background

Opal X II

________________________________________________

Opal FP-XII
Affordable fine-pitch and odd-form placer

The Opal FP-X^II has a high-precision single placement beam with two independent Z-servo Super Fine heads and exchangeable nozzles. It places at up to 6.8k components per hour, including connectors and odd-form components. It maintains a 30-micron accuracy with even the most challenging components. The component range is from 01005 to large connectors (45 x 100 mm), fine-pitch QFP, BGA, µBGA and CSP packages, and components up to 20 mm tall. The Opal FP-X^II holds up to 84 tape feeders, including stick and bulk parts.

The Opal FP-X^II has standard features that improve product quality and manufacturing efficiency including:

- Automatic board width and thickness adjustment for fast changeover
- Automatic temperature feedback compensates for temperature variations
- Fiducial recovery function that eliminates the need to remove and clean PCBs
- Multi-angle side illumination for any component background

Fine Pitch Heads

___________________________________________________

Topaz-XII
One machine that does it all!

The Topaz-X^II provides a perfect balance between chip and IC shooting thanks to its high precision single placement beam with eight independent controlled heads. The Topaz-X^II is available in two versions. When many nozzle changes are needed and high output is important, the Flying Nozzle Change (FNC) head is recommended. For handling a wider component range including QFP, connectors and high components, the Super Fine head is ideal.

The high-precision single placement beam carries either four FNC heads (each with three nozzles) and four standard heads or eight Super Fine heads with exchangeable nozzles. The FNC heads exchange nozzles on the fly to increase overall machine efficiency.

With placement rates up to 20k components per hour, the Topaz-X^II is fast. Placement accuracy is 35 microns for ICs. It handles components ranging from 01005 to large connectors (45 x 100 mm), fine-pitch and components up to 15 mm tall. The Topaz-X^II holds up to 90 tape feeders, including stick and bulk parts.

Topaz XII FNC Head (On Flight Nozzles Change)

_________________________________________________

Emerald XII
Ultra accurate fine pitch and odd form placer

The Emerald-X^II is available with high-precision head assembly carrying either two Flying Nozzle Change (FNC) heads (each equipped with six nozzles), or two Super-Fine (SF) heads with automatically exchangeable nozzles. The FNC heads exchange nozzles on the fly to improve overall machine efficiency. This makes the Emerald-X^II suitable for demanding production environments where accuracy is crucial.

The Emerald-X^II handles components from 01005 to QFPs (54 x 54 mm), large connectors (45 x 100 mm), fine-pitch and components up to 20 mm tall. The Emerald-X^II is holds up to 84 tape feeders, including stick and bulk parts.

Emerald XII

______________________________________________________

General specifications
Item	Opal-XII	Opal FP-XII	Topaz-XII	Emerald-XII
Maximum output per hour	11.6k (4 heads) 17.7k (8 heads)	6.8k (Super Fine head)	20k (Super Fine head or Flying Nozzle Change head)	6.8k (Super Fine head or Flying Nozzle Change head)
IPC 9850 output per hour	9.6k (4 heads) 13.9k (8 heads)	5.9k	15.4k	5.9k
Placement accuracy at 3 sigma	50 micron for chips, 40 micron for QFPs	50 micron for chips, 30 micron for QFPs	50 micron for chips, 35 micron for QFPs	50 micron for chips, 30 micron for QFPs
Component range	0.4 x 0.2 mm (01005) to 45 x 100 mm	0.4 x 0.2 mm (01005) to 54 x 54 mm and 45 x 100 mm	0.4 x 0.2 mm (01005) to 45 x 100 mm	0.4 x 0.2 mm (01005) to 54 x 54 mm and 45 x 100 mm
Maximum component height
Standard	6.5 mm	20 mm	6.5 mm	20 mm
Optional	15 mm with area CCD camera		15 mm with area CCD camera
Programmable placement force	not applicable	not applicable	not applicable	not applicable
Maximum board size (L x W)
standard	460 x 440 mm	460 x 440 mm	460 x 440 mm	460 x 440 mm
optional	650 x 850 mm	650 x 850 mm	650 x 850 mm	650 x 850 mm
Minimum board size (L x W)	50 x 50 mm	50 x 50 mm	50 x 50 mm	50 x 50 mm
Board thickness	0.4 to 4 mm	0.4 to 4 mm	0.4 to 4 mm	0.4 to 4 mm
Automatic tool bit exchange	nozzles and/or grippers	nozzles and/or grippers	nozzles and/or grippers	nozzles and/or grippers
Tape feeding positions (8 mm)	100 single tapes	84 single tapes	96 single tapes	84 single tapes
Feeder options	tape, bulk, stick, manual tray, strips, re-use, tube, waffle pack	tape, bulk, stick, manual tray, strips, re-use, tube, waffle pack	tape, bulk, stick, manual tray, strips, re-use, tube, waffle pack	tape, bulk, stick, manual tray, strips, re-use, tube, waffle pack
Footprint (L x W) incl. front side feeder trolleys	1650 x 1408 mm	1650 x 1408 mm	1650 x 1408 mm	1650 x 1408 mm

Chiama, interessati novità per schede LED